robust design of microelectronics assemblies against mechanical shock temperature and moisture

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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
Author : E-H Wong,Y.-W. Mai
Publisher : Woodhead Publishing
Release Date : 2015-05-23
ISBN 10 : 0857099116
Pages : 482 pages
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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study

Directed Self-assembly of Block Co-polymers for Nano-manufacturing
Author : Roel Gronheid,Paul Nealey
Publisher : Woodhead Publishing
Release Date : 2015-07-17
ISBN 10 : 0081002610
Pages : 328 pages
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The directed self-assembly (DSA) method of patterning for microelectronics uses polymer phase-separation to generate features of less than 20nm, with the positions of self-assembling materials externally guided into the desired pattern. Directed self-assembly of Block Co-polymers for Nano-manufacturing reviews the design, production, applications and future developments needed to facilitate the widescale adoption of this promising technology. Beginning with a solid overview of the physics and chemistry of block copolymer (BCP) materials, Part 1 covers the synthesis of new materials and new processing methods for DSA. Part 2 then goes on to outline the key modelling and characterization principles of DSA, reviewing templates and patterning using topographical and chemically modified surfaces, line edge roughness and dimensional control, x-ray scattering for characterization, and nanoscale driven assembly. Finally, Part 3 discusses application areas and related issues for DSA in nano-manufacturing, including for basic logic circuit design, the inverse DSA problem, design decomposition and the modelling and analysis of large scale, template self-assembly manufacturing techniques. Authoritative outlining of theoretical principles and modeling techniques to give a thorough introdution to the topic Discusses a broad range of practical applications for directed self-assembly in nano-manufacturing Highlights the importance of this technology to both the present and future of nano-manufacturing by exploring its potential use in a range of fields

Proceedings of the ... International Symposium on Microelectronics
Author : N.A
Publisher : N.A
Release Date : 1999
ISBN 10 :
Pages : 329 pages
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Proceedings 1998 International Symposium on Microelectronics
Author : N.A
Publisher : Society of Photo Optical
Release Date : 1998
ISBN 10 :
Pages : 1046 pages
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Proceedings 1999 International Symposium on Microelectronics
Author : Dick Gehman,International Microelectronics and Packaging Society,Society of Photo-optical Instrumentation Engineers
Publisher : N.A
Release Date : 1999
ISBN 10 :
Pages : 806 pages
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Robust Reliability in the Mechanical Sciences
Author : Yakov Ben-Haim
Publisher : Springer Science & Business Media
Release Date : 2012-12-06
ISBN 10 : 3642611540
Pages : 233 pages
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The aim of the book is to develop methodology for reliablity analysis which is particularly suited to the types of partial information characteristic of mechanical systems and structures. The book is designed as an upper-level undergraduate or first-year graduate text on robust reliability of mechanical systems. It will give the student or engineer a working knowledge of robust reliability which will enable him to analyse the reliability of mechanical systems. Each chapter is introduced with a brief conceptual survey of the main ideas, which are then developed through examples. Problems at the end of each chapter give the student the opportunity to strengthen and extend his or her understanding.

Mechanics of Microelectronics
Author : G.Q. Zhang,W.D. van Driel,X.J. Fan
Publisher : Springer Science & Business Media
Release Date : 2006-08-25
ISBN 10 : 1402049358
Pages : 566 pages
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This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.

System Reliability
Author : Constantin Volosencu
Publisher : BoD – Books on Demand
Release Date : 2017-12-20
ISBN 10 : 9535137050
Pages : 396 pages
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Researchers from the entire world write to figure out their newest results and to contribute new ideas or ways in the field of system reliability and maintenance. Their articles are grouped into four sections: reliability, reliability of electronic devices, power system reliability and feasibility and maintenance. The book is a valuable tool for professors, students and professionals, with its presentation of issues that may be taken as examples applicable to practical situations. Some examples defining the contents can be highlighted: system reliability analysis based on goal-oriented methodology; reliability design of water-dispensing systems; reliability evaluation of drivetrains for off-highway machines; extending the useful life of asset; network reliability for faster feasibility decision; analysis of standard reliability parameters of technical systems' parts; cannibalisation for improving system reliability; mathematical study on the multiple temperature operational life testing procedure, for electronic industry; reliability prediction of smart maximum power point converter in photovoltaic applications; reliability of die interconnections used in plastic discrete power packages; the effects of mechanical and electrical straining on performances of conventional thick-film resistors; software and hardware development in the electric power system; electric interruptions and loss of supply in power systems; feasibility of autonomous hybrid AC/DC microgrid system; predictive modelling of emergency services in electric power distribution systems; web-based decision-support system in the electric power distribution system; preventive maintenance of a repairable equipment operating in severe environment; and others.

Advances in Micro/Nano Electromechanical Systems and Fabrication Technologies
Author : Kenichi Takahata
Publisher : BoD – Books on Demand
Release Date : 2013-05-29
ISBN 10 : 9535110853
Pages : 236 pages
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MEMS technology is increasingly penetrating into our lives and improving our quality of life. In parallel to this, advances in nanotechnology and nanomaterials have been catalyzing the rise of NEMS. Consisting of nine chapters reviewing state-of-the-art technologies and their future trends, this book focuses on the latest development of devices and fabrication processes in the field of these extremely miniaturized electromechanical systems. The book offers new knowledge and insight into design, fabrication, and packaging, as well as solutions in these aspects for targeted applications, aiming to support scientists, engineers and academic trainees who are engaged in relevant research. In the chapters, practical issues and advances are discussed for flexible microdevices, bioMEMS, intelligent implants, optical MEMS, nanomachined structures and NEMS, and others. Most of the chapters also focus on novel fabrication/packaging processes, including silicon bulk micromachining, laser micromachining, nanolithography, and packaging for implantable microelectronics enabled by nanomaterials.

Solder Joint Reliability
Author : John H. Lau
Publisher : Springer Science & Business Media
Release Date : 2013-11-27
ISBN 10 : 1461539102
Pages : 631 pages
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Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.

Die-Attach Materials for High Temperature Applications in Microelectronics Packaging
Author : Kim S. Siow
Publisher : Springer
Release Date : 2019-01-29
ISBN 10 : 3319992562
Pages : 279 pages
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This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.

Orbital Mechanics for Engineering Students
Author : Howard D Curtis
Publisher : Elsevier
Release Date : 2009-10-26
ISBN 10 : 0080887848
Pages : 744 pages
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Orbital Mechanics for Engineering Students, Second Edition, provides an introduction to the basic concepts of space mechanics. These include vector kinematics in three dimensions; Newton’s laws of motion and gravitation; relative motion; the vector-based solution of the classical two-body problem; derivation of Kepler’s equations; orbits in three dimensions; preliminary orbit determination; and orbital maneuvers. The book also covers relative motion and the two-impulse rendezvous problem; interplanetary mission design using patched conics; rigid-body dynamics used to characterize the attitude of a space vehicle; satellite attitude dynamics; and the characteristics and design of multi-stage launch vehicles. Each chapter begins with an outline of key concepts and concludes with problems that are based on the material covered. This text is written for undergraduates who are studying orbital mechanics for the first time and have completed courses in physics, dynamics, and mathematics, including differential equations and applied linear algebra. Graduate students, researchers, and experienced practitioners will also find useful review materials in the book. NEW: Reorganized and improved discusions of coordinate systems, new discussion on perturbations and quarternions NEW: Increased coverage of attitude dynamics, including new Matlab algorithms and examples in chapter 10 New examples and homework problems